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Faculty of Engineering and Green Technology
Published Scholarly Output
Heat transfer enhancement by flexible printed circuit board's deformation
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Heat transfer enhancement by flexible printed circuit board's deformation
Journal
International Communications in Heat and Mass Transfer
ISSN
0735-1933
Date Issued
2017-05
Author(s)
C.H. Lim
Faculty of Engineering and Green Technology
M.Z. Abdullah
I.A. Azid
C.Y. Khor
DOI
https://doi.org/10.1016/j.icheatmasstransfer.2017.04.004
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