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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications
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Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications
Journal
2008 2nd Electronics Systemintegration Technology Conference
Date Issued
2008-09
Author(s)
S. Mallik
N.N. Ekere
A.E. Marks
A. Seman
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
DOI
10.1109/ESTC.2008.4684527
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ProceedingsConference.png
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Checksum
(MD5):305290eae19885e3ad5813824a3510c7
