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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly
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Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly
Journal
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)
Date Issued
2008-11
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
S. Mallik
A. Seman
A. Marks
N.N. Ekere
DOI
10.1109/IEMT.2008.5507801
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Checksum
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