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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes
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Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes
Journal
Materials & Design
ISSN
0261-3069
Date Issued
2009-10
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
S. Ramesh
S. Mallik
A. Seman
N. Ekere
DOI
10.1016/j.matdes.2009.01.028
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Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
