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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assembly
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Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assembly
Journal
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium
ISSN
1089-8190
Date Issued
2007-10
Author(s)
A. E. Marks
S. Mallik
N. N. Ekere
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
DOI
10.1109/IEMT.2007.4417048
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Checksum
(MD5):305290eae19885e3ad5813824a3510c7
