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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives
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Effect of epoxy and filler concentrations on curing behaviour of isotropic conductive adhesives
Journal
Journal of Thermal Analysis and Calorimetry
ISSN
1388-6150
Date Issued
2011-02-15
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
Lam Wai Man
DOI
10.1007/s10973-011-1340-0
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(MD5):21881560e0c3c9c06b18c6e8fdc11acf
