Skip to main content
English
Čeština
Deutsch
Español
Français
GÃ idhlig
Latviešu
Magyar
Nederlands
Português
Português do Brasil
Suomi
Log In
Email address
Password
Log in
Have you forgotten your password?
Home
Browse Our Collection
Researchers
Scholarly Output
Consultancy/Projects
Statistics
Log In
Email address
Password
Log in
Have you forgotten your password?
Home
Faculties / Institutes
Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives
Details
Export
Statistics
Options
Show all metadata (technical view)
Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives
Journal
Sadhana
ISSN
0256-2499
Date Issued
2009-10
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
S. Mallik
A. Seman
N. N. Ekere
DOI
10.1007/s12046-009-0046-5
File(s)
Loading...
Download
Name
Journal Article.png
Size
3.11 KB
Format
PNG
Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
