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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Thermal, Microstructure, and Hardness Properties of Molybdenum Nanoparticles Added Tin -Bismuth Solder Alloy for Low-Temperature Soldering Application
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Thermal, Microstructure, and Hardness Properties of Molybdenum Nanoparticles Added Tin -Bismuth Solder Alloy for Low-Temperature Soldering Application
Journal
Lecture Notes in Mechanical Engineering
Materials, Design and Manufacturing for Sustainable Environment
ISSN
2195-4356
Date Issued
2022-09-29
Author(s)
Amares Singh
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
Elango Natarajan
Wei-Hong Tan
Shamini Janasekaran
DOI
10.1007/978-981-19-3053-9_3
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Book & Book Chapter.png
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18.2 KB
Format
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Checksum
(MD5):6459b36f69f027e855edacb3be8e57e9
