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Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board
Journal
Microelectronics Reliability
ISSN
0026-2714
Date Issued
2017-05
Author(s)
DOI
https://doi.org/10.1016/j.microrel.2017.03.022
File(s)
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Name
Picture1.png
Size
3.11 KB
Format
PNG
Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
