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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives
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Investigation of dynamic and mechanical thermal behavior of isotropic conductive adhesives
Journal
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)
Date Issued
2013-12
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
Chew Chee Sean
Tan Chia Chiun
Liew Jian Ping
DOI
10.1109/EPTC.2013.6745763
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ProceedingsConference.png
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