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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly
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Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly
Journal
IEEE Transactions on Reliability
ISSN
0018-9529
Date Issued
2024-03
Author(s)
Siang Miang Yeo
Ho Kwang Yow
Lee Kong Chian Faculty of Engineering and Science
Keat Hoe Yeoh
Siti Nur Farhana Mohamad Azenal
DOI
10.1109/TR.2023.3294224
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