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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications
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Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications
Journal
Materials & Design
ISSN
0261-3069
Date Issued
2009-12
Author(s)
S. Mallik
N.N. Ekere
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
A.E. Marks
A. Seman
DOI
10.1016/j.matdes.2009.05.028
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Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
