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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance
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Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance
Journal
2009 11th Electronics Packaging Technology Conference
Date Issued
2009-12
Author(s)
S. Mallik
J. Thieme
R. Bauer
N. N. Ekere
A. Seman
R. Bhatti
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
DOI
10.1109/EPTC.2009.5416423
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ProceedingsConference.png
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Checksum
(MD5):305290eae19885e3ad5813824a3510c7
