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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
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Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly
Journal
Journal of Materials Processing Technology
ISSN
0924-0136
Date Issued
2009-04
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
S. Mallik
A. Seman
A. Marks
N.N. Ekere
DOI
10.1016/j.jmatprotec.2008.09.013
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Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
