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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes
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Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes
Journal
2008 2nd Electronics Systemintegration Technology Conference
Date Issued
2008-09
Author(s)
A. Seman
N.N. Ekere
S.J. Ashenden
S. Mallik
A.E. Marks
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
DOI
10.1109/ESTC.2008.4684351
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ProceedingsConference.png
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Checksum
(MD5):305290eae19885e3ad5813824a3510c7
