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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Modeling the Structural Breakdown of Solder Paste Using the Structural Kinetic Model
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Modeling the Structural Breakdown of Solder Paste Using the Structural Kinetic Model
Journal
Journal of Materials Engineering and Performance
ISSN
1059-9495
Date Issued
2009-05-02
Author(s)
S. Mallik
N. N. Ekere
A. E. Marks
A. Seman
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
DOI
10.1007/s11665-009-9448-0
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Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
