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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging
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Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
ISSN
2156-3950
Date Issued
2023-07
Author(s)
Siang Miang Yeo
Ho Kwang Yow
Lee Kong Chian Faculty of Engineering and Science
Keat Hoe Yeoh
DOI
https://10.1109/TCPMT.2023.3293114
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