Thermal field simulation of multi package LED module

Journal

2015 International Symposium on Next-Generation Electronics (ISNE)

Date Issued

2015-05

Author(s)

KoonChun Lai

ChoonFoong Tan

KokSeng Ong

KokEng Ng

DOI

http://dx.doi.org/10.1109/ISNE.2015.7132012

File(s)

Name

ProceedingsConference.png

Size

28.25 KB

Format

PNG

Checksum

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