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Thermal stability enhancement of perovskite MAPbI3 film at high temperature (150 °C) by PMMA encapsulation
Journal
Journal of Materials Science: Materials in Electronics
ISSN
0957-4522
Date Issued
2021-05-05
Author(s)
DOI
https://doi.org/10.1007/s10854-021-06041-y
File(s)
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Picture1.png
Type
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Size
3.11 KB
Format
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Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
