Interfacial reactions between Sn-3.8 Ag-0.7Cu solder and Ni-W alloy films

Journal

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

Date Issued

2012-11

Author(s)

C.S. Chew

A.S.M.A. Haseeb

Mohd. Rafie Johan

DOI

10.1109/IEMT.2012.6521744

File(s)

Name

ProceedingsConference.png

Size

28.25 KB

Format

PNG

Checksum

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