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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications
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Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications
Journal
Russian Journal of Electrochemistry
ISSN
1023-1935
Date Issued
2016-08
Author(s)
Ayad Saeed
Balachandran Ruthramurthy
Wong Hin Yong
Ong Boon Hoong
Tan Kar Ban
Ho Kwang Yow
Lee Kong Chian Faculty of Engineering and Science
Srimala Sreekantan
DOI
https://link.springer.com/article/10.1134/S1023193516040121
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