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Impact of 3% Molybdenum(Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint
Journal
IOP Conference Series: Materials Science and Engineering
ISSN
1757-8981
Date Issued
2022-02-01
Author(s)
DOI
https://iopscience.iop.org/article/10.1088/1757-899X/1225/1/012029
Abstract
<jats:title>Abstract</jats:title>
<jats:p>The research investigates the impact of 3 % molybdenum (Mo) nanoparticles onthe interfacial properties and shear stress of the leadfree Sn58Bi (SB) solder joint. The research aims to providea resemblance between the interfacial and shear properties withthe additions of Mo nanoparticles. The interfacial between Mo added to the solder joint comprises of the common intermetallic (IMC) layer of Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub>andadditional IMCs of MoSn<jats:sub>2</jats:sub>. that acted as further strengthening mechanism for the joint. Therefore, the shear strength of Mo reinforced solder joint was 32% higher compared to the pristine solder. The introduction of Mo into the SB solder resulted in an advantageous outcome.</jats:p>
<jats:p>The research investigates the impact of 3 % molybdenum (Mo) nanoparticles onthe interfacial properties and shear stress of the leadfree Sn58Bi (SB) solder joint. The research aims to providea resemblance between the interfacial and shear properties withthe additions of Mo nanoparticles. The interfacial between Mo added to the solder joint comprises of the common intermetallic (IMC) layer of Cu<jats:sub>6</jats:sub>Sn<jats:sub>5</jats:sub>andadditional IMCs of MoSn<jats:sub>2</jats:sub>. that acted as further strengthening mechanism for the joint. Therefore, the shear strength of Mo reinforced solder joint was 32% higher compared to the pristine solder. The introduction of Mo into the SB solder resulted in an advantageous outcome.</jats:p>
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