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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes
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The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes
Journal
Materials & Design
ISSN
0261-3069
Date Issued
2010-03
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
Lam Wai Man
N.N. Ekere
S. Mallik
DOI
10.1016/j.matdes.2009.09.051
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Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
