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Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesives
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Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesives
Journal
2009 11th Electronics Packaging Technology Conference
Date Issued
2009-12
Author(s)
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
Lam Wai Man
S. Ramesh
Lim Chia Wea
N.N. Ekere
S. Mallik
A. Seman
DOI
10.1109/EPTC.2009.5416511
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ProceedingsConference.png
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Checksum
(MD5):305290eae19885e3ad5813824a3510c7
