Skip to main content
English
Čeština
Deutsch
Español
Français
GÃ idhlig
Latviešu
Magyar
Nederlands
Português
Português do Brasil
Suomi
Log In
Email address
Password
Log in
Have you forgotten your password?
Home
Browse Our Collection
Researchers
Scholarly Output
Consultancy/Projects
Statistics
Log In
Email address
Password
Log in
Have you forgotten your password?
Home
Faculties / Institutes
Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
Thermal resistance of a thermosyphon filled with R410A operating at low evaporator temperature
Details
Export
Statistics
Options
Show all metadata (technical view)
Thermal resistance of a thermosyphon filled with R410A operating at low evaporator temperature
Journal
Applied Thermal Engineering
ISSN
1359-4311
Date Issued
2016-08
Author(s)
K.S. Ong
Gabriel Goh
K.H. Tshai
W.M. Chin
DOI
10.1016/j.applthermaleng.2016.06.080
File(s)
Loading...
Download
Name
Journal Article.png
Size
3.11 KB
Format
PNG
Checksum
(MD5):21881560e0c3c9c06b18c6e8fdc11acf
