A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Journal

MATEC Web of Conferences

ISSN

2261-236X

Date Issued

2015

Author(s)

Amares Singh

Ervina Efzan Mhd.Noor

Editor(s)

C. Guojian

Y. Muhammad

DOI

https://doi.org/10.1051/matecconf/20152702003

File(s)

Name

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Size

3.11 KB

Format

PNG

Checksum

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