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Surface Morphology and Electrical Properties of Pulse Electrodeposition of NiFe Films on Copper Substrates in Ultrasonic Field
Journal
International Journal of Electrochemical Science
ISSN
1452-3981
Date Issued
2011-08
Author(s)
R. Balachandran
H.K. Yow
B.H. Ong
K.B. Tan
K. Anuar
H.Y. Wong
DOI
10.1016/s1452-3981(23)18272-1
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Checksum
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