Skip to main content
English
Čeština
Deutsch
Español
Français
GÃ idhlig
Latviešu
Magyar
Nederlands
Português
Português do Brasil
Suomi
Log In
Email address
Password
Log in
Have you forgotten your password?
Home
Browse Our Collection
Researchers
Scholarly Output
Consultancy/Projects
Statistics
Log In
Email address
Password
Log in
Have you forgotten your password?
Home
Faculties / Institutes
Lee Kong Chian Faculty of Engineering and Science
Published Scholarly Output
A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection
Details
Export
Statistics
Options
Show all metadata (technical view)
A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection
Journal
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium
ISSN
1089-8190
Date Issued
2007-10
Author(s)
S. Mallik
N. N. Ekere
Rajkumar Durairaj, R.Durairaj
Lee Kong Chian Faculty of Engineering and Science
A. E. Marks
DOI
10.1109/IEMT.2007.4417065
File(s)
Loading...
Download
Name
ProceedingsConference.png
Size
28.25 KB
Format
PNG
Checksum
(MD5):305290eae19885e3ad5813824a3510c7
