C.H. LimM.Z. AbdullahI.A. AzidC.Y. Khor2024-10-302024-10-302017-05https://doi.org/10.1016/j.icheatmasstransfer.2017.04.004https://dspace-cris.utar.edu.my/handle/123456789/5639Heat transfer enhancement by flexible printed circuit board's deformationjournal-article