Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications

S. MallikN.N. EkereA.E. MarksA. SemanRajkumar Durairaj, R.DurairajR.DurairajRajkumar Durairaj2024-12-232024-12-232008-0910.1109/ESTC.2008.4684527https://dspace-cris.utar.edu.my/handle/123456789/7612Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applicationsproceedings-article