Rajkumar Durairaj, R.DurairajR.DurairajRajkumar DurairajS. MallikA. SemanA. MarksN.N. Ekere2024-12-232024-12-232008-1110.1109/IEMT.2008.5507801https://dspace-cris.utar.edu.my/handle/123456789/7614Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assemblyproceedings-article