Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assembly

A. E. MarksS. MallikN. N. EkereRajkumar Durairaj, R.DurairajR.DurairajRajkumar Durairaj2024-12-262024-12-262007-1010.1109/IEMT.2007.4417048https://dspace-cris.utar.edu.my/handle/123456789/8130Effect of Abandon Time on Print Quality and Rheological Characteristics for Lead-Free Solder Pastes used for Flip-Chip Assemblyproceedings-article