Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly

Siang Miang YeoHo Kwang YowKeat Hoe YeohSiti Nur Farhana Mohamad Azenal2024-12-242024-12-242024-0310.1109/TR.2023.3294224https://dspace-cris.utar.edu.my/handle/123456789/7771Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assemblyjournal-article