A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnection

S. MallikN. N. EkereRajkumar Durairaj, R.DurairajR.DurairajRajkumar DurairajA. E. Marks2024-12-262024-12-262007-1010.1109/IEMT.2007.4417065https://dspace-cris.utar.edu.my/handle/123456789/8132A Study of the Rheological Properties of Lead free Solder Paste formulations used for Flip-Chip Interconnectionproceedings-article