Amares SinghHui Leng ChooWei Hong TanRajkumar Durairaj, R.DurairajR.DurairajRajkumar DurairajShamini JanasekaranM. S. Senthil Saravanan2025-08-062025-08-062025-02-2410.1007/s11837-025-07201-9https://dspace-cris.utar.edu.my/handle/123456789/11294This review paper compiles and provides a review of the latest and relevant research on the nanoparticle-reinforced low-temperature SnBi solder. The physical, electromigration and thermomigration, microstructural, interfacial and mechanical properties of a solder are vital to the reliability of the electronic components. Generally, reinforcement of nanoparticles is beneficial to the properties of low-temperature SnBi solder. Literature on the types of nanoparticles added to SnBi focusing on these properties is available but is not outlined in a competent review. This paper provides a significant review on this topic to provide insight into SnBi solder alloy as an alternative solder in the electronic packaging industry.enBI EUTECTIC SOLDERLEAD-FREE SOLDERSINTERMETALLIC COMPOUNDSMELTING TEMPERATUREPARTICLES ADDITIONSHEAR-STRENGTHCREEP-BEHAVIORGRAIN-GROWTHTI ADDITIONCUtext::review