Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance

S. MallikJ. ThiemeR. BauerN. N. EkereA. SemanR. BhattiRajkumar Durairaj, R.DurairajR.DurairajRajkumar Durairaj2024-12-242024-12-242009-1210.1109/EPTC.2009.5416423https://dspace-cris.utar.edu.my/handle/123456789/7724Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performanceproceedings-article