Rajkumar Durairaj, R.DurairajR.DurairajRajkumar DurairajS. MallikA. SemanA. MarksN.N. Ekere2024-12-232024-12-232009-0410.1016/j.jmatprotec.2008.09.013https://dspace-cris.utar.edu.my/handle/123456789/7673Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assemblyjournal-article