Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packaging

Siang Miang YeoHo Kwang YowKeat Hoe Yeoh2024-11-112024-11-112023-07https://10.1109/TCPMT.2023.3293114https://dspace-cris.utar.edu.my/handle/123456789/6684Critical Threshold Limit for Effective Solder Void Size Reduction by Vacuum Reflow Process for Power Electronics Packagingjournal-article