Siang Miang YeoHo Kwang YowKeat Hoe YeohShahrul Haizal bin Ishak2024-10-212024-10-212022-0810.1109/TCPMT.2022.3189995https://dspace-cris.utar.edu.my/handle/123456789/3918Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assemblyjournal-article