Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesives

Rajkumar Durairaj, R.DurairajR.DurairajRajkumar DurairajLam Wai ManS. RameshLim Chia WeaN.N. EkereS. MallikA. Seman2024-12-242024-12-242009-1210.1109/EPTC.2009.5416511https://dspace-cris.utar.edu.my/handle/123456789/7726Investigation of wall-slip behavior in lead-free solder pastes and isotropic conductive adhesivesproceedings-article